TE Connectivity wins 2020 ASPENCORE World Electronics Achievement Award

Thermal bridge I/O connectors recognized in the ‘High Performance Passive/Discrete Devices of the Year’ category

SHANGHAI, Nov. 17, 2020 /PRNewswire/ — TE Connectivity (TE), a world leader in innovative connectivity and solutions for high-speed computing and networking applications, has won the 2020 ASPENCORE World Electronics Achievement Award for its thermal bridge input/output (I/O) connectors. The products were recognized in the "High Performance Passive/Discrete Devices of the Year" category, based on their superior thermal performance and flexibility, technological innovations and remarkable contributions towards the electronics industry.

Zhiliang Yu (left), Engineering Director, Manufacturing Process Development, TE’s Data and Devices business unit, accepted the “High Performance Passive/Discrete Devices of the Year” award on behalf of TE.
Zhiliang Yu (left), Engineering Director, Manufacturing Process Development, TE’s Data and Devices business unit, accepted the “High Performance Passive/Discrete Devices of the Year” award on behalf of TE.

"We are pleased that TE thermal bridge I/O connectors have been recognized by ASPENCORE to receive this award from a highly competitive range of entries. This innovative product was developed by TE engineers to optimize heat dissipation and continued system performance as power requirements continue to increase," said Erin Byrne, Data and Devices business unit CTO at TE Connectivity. "We aim to design outstanding products to help our customers address constant challenges in designing their next-generation computing and networking systems."

As systems, including servers, switches and routers, have become more sophisticated and deliver higher speeds, their power requirements have also increased, leading to a need for new solutions that can handle more heat. TE Connectivity’s thermal bridge technology was developed to help solve this problem, specifically in fixed cooling applications with restricted airflow, liquid cooling or cold plates.

With integrated mechanical springs, the innovative solutions can provide up to 2x better thermal resistance over most traditional thermal technologies such as gap pads or thermal pads. Optimized for I/O applications using cold plates with liquid cooling or heat pipes, ganged heatsinks or direct chassis conduction applications with little to no airflow, TE’s thermal bridge solutions feature a near-zero plate gap in the bridge construction for substantially improved thermal transfer and minimal levels of compression. In addition, the new solution delivers long-lasting and consistent thermal performance with an elastic compression design that can be resistant to set or relaxation over time. This feature can also help to reduce component replacement during system servicing.

In addition to the 2020 ASPENCORE Award, TE’s thermal bridge recently earned a bronze award in the Connectivity category of WTWH Media’s 2020 Leadership in Engineering Achievement Program (LEAP) Awards.

To learn more about TE’s thermal bridge I/O connectors, please click here.

Organized by ASPENCORE, the world’s largest electronics industry media group, the World Electronics Achievement Awards (WEAA) identify and honor companies and individuals who have made outstanding contributions to innovation and the worldwide development of the electronics industry. Winners are selected by a judging panel comprising ASPENCORE analysts and editors in Asia, the US and Europe, as well as through online voting by engineers across three continents.

The LEAP Awards celebrate the most innovative and forward-thinking products serving the design engineering space, showcasing global electronic engineering achievements in 12 categories. This year’s winners were chosen by an independent judging panel of 14 engineering and academic professionals, and entries were submitted from around the globe. WTWH publications participating in the program included Design World, Fluid Power World, Fastener Engineering, and EE World.

TE Connectivity (TE) headquartered in Switzerland, is a $12 billion global industrial technology company creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions, proven in harsh environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With approximately 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com.cn and on WeChat.

TE Connectivity, TE connectivity (logo), TE, and EVERY CONNECTION COUNTS are trademarks owned or licensed by the TE Connectivity Ltd. family of companies.  Other logos, product(s) and/or company names might be trademarks of their respective owners.


Laetitia Donovan
TE Connectivity
[email protected]
+1 717 986 7326


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